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Won the IMAPS 2016 AWARD

We won the 'Best of Session' Award in IMAPS 2016 - Pasadena


Click here for a technical paper 'High Thermal Conductive Die Attach Paste Using Polymer and Micron Size Silver for Power Semiconductor Package' by Howard (Hwail) Jin, Kewei Xu, Loreto Naungayan, Jose Quinones.

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