Applications

3D Packaging

3D Packaging

Alpha Advanced Materials offers a full line of industry leading solder fluxing and alloy performance materials for the next generation semiconductor packaging applications.  The latest range of Alpha paste fluxes, solder spheres and solder pastes are all designed and formulated to meet the industries requirements for next generation packaging.

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Chip on Wifer

Chip on Wafer

Portable mobile devices is growing rapidly together with the growth of Internet of Things technology this is driving the demand for both increased functional intergration as well as increased packaging complexity and sophistication.  To accerlerate  package performance, conventional interconnect technology  is shifting from 2D packaging to more advanced 2.5D and 3D packaging.

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Die Attach

Die Attach

Alpha Advanced Materials, as the world leader in the development, manufacturing and sales of innovative materials used in the electronics industry, offers the most exceptional and versatile range of materials for die attach (ATROX®  Argomax®) used in semiconductor packaging and LED markets. Alpha Advanced Materials' ATROX® brand of ATROX® die attach paste and ATROX® die attach film products offer excellent reliability and high throughput for various packages.

Alpha Advanced Materials products are die attach paste for ATROX® 800HT2, ATROX® 800HT5, ATROX® 800HT5, etc and die attach film for ATROX® CF.100-7B and ATROX® CF.200-1D

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Flipchip

Flip Chip

Alpha Advanced Materials liquid fluxes are formulated to provide universal soldering performance for flip chip and wafer level processing.  Our fluxes are designed to provide the highest level of performance and reliability by using the latest Alpha® flux technology.  Our newest line of liquid fluxes offer ultra low no-clean residue for Copper Pillar thermo-compression bonding (TCB) applications for convention flip chip reflow to 3D stacking processes.

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High Reliability

High Reliability

Alpha Advanced Materials offers a full line of getter products and bonding materials that improve working life and reduces field failures in extremely harsh environments. STAYDRY®,HiCap®, GA2000-2 and H2-3000 getter products are formulated to scavenge moisture, particles and hydrogen. Products cover a range of mechanical properties and application techniques. Specific enabling technology products support stringent industry reliability standards; including JEDEC, MIL specification and Bellcore.

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Pop/Sip

PoP/SiP/2.5D Packaging

Alpha offers a full line of industry leading solder fluxing and alloy performance materials for the next generation semiconductor packaging applications.  The latest range of Alpha paste fluxes, solder spheres and solder pastes are all designed and formulated to meet the industries requirements for next generation packaging.  Alpha’s  product line offerings include low-Ag alloys, halogen-free fluxing technologies, higher thermal cycling and drop resistance alloys combine to deliver higher activity and better reliability for your high volume manufacturing needs.

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sphere attach

Sphere Attach

In BGA/CSP package assembly, the solder ball attach process is one of the major yield points that impacts the overall product yield and cycle time because it is the last process step to form electrical and mechanical connection to  the complete package.

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chip on wafer

Thermal Management

Alpha Advanced Materials offers a full line of thermoplastic and thermosetting polymer bonding products for thermal management of semiconductor and electronics applications . These products cover a complete range of mechanical, electrical and thermal properties and be used for temporary mounting or permanent bonding. Specific enabling products support stringent industry reliability standards; including JEDEC and MIL specification. Alpha Advanced Materials' thermal management products are the premier choice for all of your high performance bonding applications.

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wafer bump

Wafer Bump

Wafer level packaging provides the smallest form factor in packaging technology. 

Whether it is mobile electronic devices or high performance devices, there is a demand for the smallest, lightest devices that can also offer the highest performance and reliability.

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wafer thining

Wafer Thinning

Alpha Advanced Materials offers high performance temporary bonding materials for wafer thinning applications. Products include spin coat-able pastes which are designed for superior bonding of dissimilar surfaces, excellent solvent resistance and quick and easy residue-free debonding. The products are extremely versatile for various wafer applications such as lapping, polishing and cutting of GaAs or Silicon wafers and also for slider head manufacturing or lens polishing applications.

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