3D Packaging

Alpha Advanced Materials offers a full line of industry leading solder fluxing and alloy performance materials for the next generation semiconductor packaging applications.  The latest range of Alpha paste fluxes, solder spheres and solder pastes are all designed and formulated to meet the industries requirements for next generation packaging.

Alpha Advanced Materials'  product line offerings include low-Ag alloys, halogen-free fluxing technologies, higher thermal cycling and drop resistance alloys combine to deliver higher activity and better reliability for your high volume manufacturing needs.

Alpha Advanced Materials fluxes are formulated using the latest flux technology to provide universal soldering performance for flip chip and wafer level processing. Our newest line of fluxes offer ultra low no-clean residue for Copper Pillar thermo-compression bonding (TCB) applications for convention flip chip reflow to 3D stacking processes. 

Alpha Advanced Materials next generation high reliability alloys employ advanced metallurgy technologies for all of your solder hierarchy needs; providing high-reliability spheres in the standard SAC, low and mid-range alloy temperature segments.  The latest range of Alpha® spheres and alloys such as Maxrel PlusTM or SBX02TM for solder paste help assure alloy-to-alloy compatibility providing stronger more reliable solder joints.  All of Alpha Advanced Materials solder pastes and spheres conform to our customers’ unique processes, as well as the challenging environmental regulations they are required to follow.


Liquid Flux


Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Dispense Print Dip Spray Halide Free Activity Tackiness Low Residue
NCX-009 No Clean           o Lo Lo o Wafer/FCCSP 
WS3018-FS Water Soluble   o     o   Hi Lo   FCCSP


Paste flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
NCX-390 No Clean o   o o Hi Med Hi BGA/FCCSP
OL107 No Clean o   o   Hi Med Hi BGA/POP
NCX PRL-505 Epoxy o o o   Lo Hi Hi BGA/FCCSP/Wafer
WS3018-HA Water  Soluble o o o   Lo Med Hi FCCSP
WS3018-LV   o o   Lo Lo Lo FCCSP
WS5018-HA o   o   Hi Med Hi FCCSP


Solder paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Activity Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
OM-340 No Clean   o   o Hi Hi o o   o     SiP/BGA
WS609 Water Soluble   o   o Hi Hi   o o o     SiP/BGA
WS693CPS   o   o Hi Hi o o   o o o SiP/BGA


Sphere

Type Alloy Alloy Tin(Sn) Lead
(Pb)
Silver (Ag) Bismuth (Bi) Copper (Cu) Melting Point (oC) Attributes
Eutectic Solidus Liquidus
Lead Free Standard Sn96.5/Ag3.5 96.5 -- 3.5 -- -- 221 -- -- Eutectic Tin-Silver
SAC405 95.5 -- 4.0 -- 0.5 -- 217 225 Industry Standard Lead-Free
SAC305 96.5 -- 3.0 -- 0.5 -- 217 221 Industry Standard Lead-Free
SAC125 98.3 -- 1.2 -- 0.5 -- 217 228 Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) 
SAC105 98.5 -- 1.0 -- 0.5 -- 217 228
High Reliability SACX Plus®
Modified SAC0307 Alloy -- 217 228
Maxrel TM Modified SAC -- 212 220 High thermal cycle resistance and better than standard drop shock performance
Maxrel Plus TM Modified (Sb Free) -- 211 216
Standard Sn42/Bi57.6/Ag0.4  42 --
 0.4  57.6 --
138 -- -- Lead free low melting point
Tin Lead
Sn62/Pb36/Ag2 62 36 2.0 -- -- 179 -- -- Eutectic Tin-Lead-Silver
Sn63/Pb37 63 37 -- -- -- 183 -- -- Eutectic Tin-Lead
  
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