Die Attach

Alpha Advanced Materials, as the world leader in the development, manufacturing and sales of innovative materials used in the electronics industry, offers the most exceptional and versatile range of materials for die attach (ATROX®  Argomax®) used in semiconductor packaging and LED markets. Alpha Advanced Materials' ATROX® brand of ATROX® die attach paste and ATROX® die attach film products offer excellent reliability and high throughput for various packages.

Alpha Advanced Materials products are die attach paste for ATROX® 800HT2, ATROX® 800HT5, ATROX® 800HT5, etc and die attach film for ATROX® CF.100-7B and ATROX® CF.200-1D

Die Attach

Product Name Format Deposition Method Thermal (W/m-k) Key Features Component Type
Water Lamination Dispense Print Bare Silicon Compatibility Modulus
ATROX®
800HT2
Paste   o   High   High SO, TO, QFN, TSSO 
ATROX®
800HT2V
Paste   o o Extreme   Mid QFN, SO, TO, TSSO, Cu Clip
ATROX®
800HT7
Paste   o o High o Low QFP, QFN, LGA, SO, BGA 
ATROX®
800HT1V
Paste   o   Extreme o Mid QFN, BGA, SO, TO
ATROX®
800HT5
Paste   o   High o Low QFN, SO, TO, TSSO, LGA, QFP
ATROX®
558-2C31
Paste   o   Low o Low QFN, SO, BGA, QFP, TSSO, LGA
ATROX®
CF.100-7B
Film o     Low o Low QFN, SO, BGA, QFP, TSSO, LGA
ATROX®
CF.200-1D
Film o     High o Mid QFN, SO, BGA, QFP, TSSO, LGA, TO
ATROX®
5803HT
Paste   o o Medium o Low QFN, SO, TSSO, LGA
ATROX®
HT900-1
Paste   o o Low o Low LED packages
ATROX®
HT900-3
Paste   o o Medium o Mid LED packages
ATROX®
HT900-6B
Paste   o o High o High LED packages
ARGOMAX® 8035 Film o     Extreme   High Power Modules and Discretes
ARGOMAX® 2030 Paste   o o Extreme   High Power Modules


Solder Paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Activity Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
NCP1213 No Clean o     o Hi Hi     o       Leadframe
  
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