Flip Chip

Alpha Advanced Materials liquid fluxes are formulated to provide universal soldering performance for flip chip and wafer level processing.  Our fluxes are designed to provide the highest level of performance and reliability by using the latest Alpha® flux technology.  Our newest line of liquid fluxes offer ultra low no-clean residue for Copper Pillar thermo-compression bonding (TCB) applications for convention flip chip reflow to 3D stacking processes.

Alpha Advanced Materials provides the highest level of performance for both No-clean and Water soluble liquid flux  solutions to meet every customer application needs.

We operate many Liquid Soldering flux production facilities around the world, and each of these sites follows strict standards that assure high product quality and unmatched consistency

 

Paste Flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
NCX No Clean o   o   Lo Med Hi BGA/FCCSP
NCX-390 o   o o Hi Med Hi BGA/FCCSP
NCX-FD o   o   Hi Med Hi BGA/FCCSP
NCX PRL-505 Epoxy o o o   Lo Hi Hi BGA/FCCSP/Wafer
WS3018-HA Water  Soluble o o o   Lo Med Hi FCCSP
WS3018-LV   o o   Lo Lo Lo FCCSP
WS5018-HA o   o   Hi Med Hi FCCSP
WS6018-HA o   o o Med Med Hi FCCSP


Liquid Flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Dispense Print Dip Spray Halide Free Activity Tackiness Low Residue
NCX-009 No Clean           o Lo Lo o Wafer/FCCSP 
WS3018-FS Water Soluble   o     o   Hi Lo   FCCSP
  
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