PoP/SiP/2.5D Packaging

Alpha offers a full line of industry leading solder fluxing and alloy performance materials for the next generation semiconductor packaging applications.  The latest range of Alpha paste fluxes, solder spheres and solder pastes are all designed and formulated to meet the industries requirements for next generation packaging.  Alpha’s  product line offerings include low-Ag alloys, halogen-free fluxing technologies, higher thermal cycling and drop resistance alloys combine to deliver higher activity and better reliability for your high volume manufacturing needs.

Alpha fluxes are formulated using the latest Alpha® flux technology to provide universal soldering performance for flip chip and wafer level processing. Our newest line of fluxes offer ultra low no-clean residue for Copper Pillar thermo-compression bonding (TCB) applications for convention flip chip reflow to 3D stacking processes. 

Alpha's next generation high reliability alloys employ advanced metallurgy technologies for all of your solder hierarchy needs; providing high-reliability spheres in the standard SAC, low and mid-range alloy temperature segments.  The latest range of Alpha® spheres and alloys such as Maxrel  PlusTM or SBX02TM for solder paste help assure alloy-to-alloy compatibility providing stronger more reliable solder joints.  All of Alpha’s solder pastes and spheres conform to our customers’ unique processes, as well as the challenging environmental regulations they are required to follow.


Solder Paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Activity Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
NCP-390 No Clean   o   o Hi Hi o o   o o o SiP/BGA
OM-340     o   o Hi Hi o o   o     SiP/BGA
POP-33   o   o o Hi Hi o o     o   POP
WS609 Water Soluble   o   o Hi Hi   o o o     SiP/BGA
WS693CPS   o   o Hi Hi o o   o o o SiP/BGA

Paste Flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
OL107 No Clean o   o   Hi Med Hi BGA/POP
POP707       o o Hi Lo Hi BGA/FCCSP/POP

Conductive Die Attach

Product Name Format Deposition Method Thermal (W/m-k) Key Features Component Type
Water Lamination Dispense Print Bare Silicon Compatibility Modulus
Paste   o   Extreme o Mid QFN, BGA, SO, TO


Type Alloy Alloy Tin(Sn) Lead
Silver (Ag) Bismuth (Bi) Copper (Cu) Melting Point (oC) Attributes
Eutectic Solidus Liquidus
Lead Free Standard Sn96.5/Ag3.5 96.5 -- 3.5 -- -- 221 -- -- Eutectic Tin-Silver
SAC405 95.5 -- 4.0 -- 0.5 -- 217 225 Industry Standard Lead-Free
SAC305 96.5 -- 3.0 -- 0.5 -- 217 221 Industry Standard Lead-Free
SAC125 98.3 -- 1.2 -- 0.5 -- 217 228 Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) 
SAC105 98.5 -- 1.0 -- 0.5 -- 217 228
High Reliability SACX Plus®
Modified SAC0307 Alloy -- 217 228
SnCX Plus TM Modified SnCu (Zero Silver) Alloy -- 227 229 Low cost zero Silver alloy
Maxrel TM Modified SAC -- 212 220 High thermal cycle resistance and better than standard drop shock performance
Maxrel Plus TM Modified (Sb Free) -- 211 216
SBX02 TM Modified SnBi Alloy 138 -- -- Low temperature high reliability lead free alloy
Standard Sn42/Bi57.6/Ag0.4  42 --
 0.4  57.6 --
138 -- -- Lead free low melting point
Tin Lead Sn10/Pb90 10 90 -- -- -- -- 275 302 High-Lead for high stand off
Sn62/Pb36/Ag2 62 36 2.0 -- -- 179 -- -- Eutectic Tin-Lead-Silver
Sn63/Pb37 63 37 -- -- -- 183 -- -- Eutectic Tin-Lead
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