Sphere Attach

In BGA/CSP package assembly, the solder ball attach process is one of the major yield points that impacts the overall product yield and cycle time because it is the last process step to form electrical and mechanical connection to  the complete package.

The most popular ball attach technology in the industry is the use of pin transfer using paste flux and  solder sphere . Alpha provides industry leading fluxing technolgoy for 100% first pass yield for sphere attach process on ENIG, ENEPIG and CuOSP pad finishes.  Alpha sphere attach solutions demonstrate superior solder ball coplanarity, solder ball height, solder ball diameter and high solder ball shear for robust process yields even on poor surface conditions

 

Paste Flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
POP707 No Clean     o o Hi Lo Hi BGA/FCCSP/POP
NCX PRL-505 Epoxy o o o   Lo Hi Hi BGA/FCCSP/Wafer
WS600 Water  Soluble o o o o Hi Hi Hi BGA/wafer
WS600-MHV o o o o Hi Hi Hi BGA/wafer
WS9180-MHV o o o o Hi Hi Hi BGA/wafer
WS9190 o o o o Hi Hi Hi BGA/wafer
WSX-HF-HAHV o o o o Hi Hi Hi BGA/wafer
WS9180-M7 o o o o Hi Med Hi BGA/FCCSP
WSX-HAHF o o o o Hi Med Hi BGA/FCCSP
WSX-9200 o o o o Hi Hi Hi BGA/FCCSP
WSX-1207 o o o o Hi Med Hi BGA/FCCSP
WSX-1405A o o o o Hi Med Hi BGA/FCCSP


Sphere

Type Alloy Alloy Tin(Sn) Lead
(Pb)
Silver (Ag) Bismuth (Bi) Copper (Cu) Melting Point (oC) Attributes
Eutectic Solidus Liquidus
Lead Free Standard Sn96.5/Ag3.5 96.5 -- 3.5 -- -- 221 -- -- Eutectic Tin-Silver
SAC405 95.5 -- 4.0 -- 0.5 -- 217 225 Industry Standard Lead-Free
SAC305 96.5 -- 3.0 -- 0.5 -- 217 221 Industry Standard Lead-Free
SAC125 98.3 -- 1.2 -- 0.5 -- 217 228 Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) 
SAC105 98.5 -- 1.0 -- 0.5 -- 217 228
High Reliability SACX Plus®
Modified SAC0307 Alloy -- 217 228
SnCX Plus TM Modified SnCu (Zero Silver) Alloy -- 227 229 Low cost zero Silver alloy
Maxrel TM Modified SAC -- 212 220 High thermal cycle resistance and better than standard drop shock performance
Maxrel Plus TM Modified (Sb Free) -- 211 216
SBX02 TM Modified SnBi Alloy 138 -- -- Low temperature high reliability lead free alloy
Standard Sn42/Bi57.6/Ag0.4  42 --
 0.4  57.6 --
138 -- -- Lead free low melting point
Tin Lead Sn10/Pb90 10 90 -- -- -- -- 275 302 High-Lead for high stand off
Sn62/Pb36/Ag2 62 36 2.0 -- -- 179 -- -- Eutectic Tin-Lead-Silver
Sn63/Pb37 63 37 -- -- -- 183 -- -- Eutectic Tin-Lead
  
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