Wafer Bump

Wafer level packaging provides the smallest form factor in packaging technology. 

Whether it is mobile electronic devices or high performance devices, there is a demand for the smallest, lightest devices that can also offer the highest performance and reliability.

Wafer bumping technology provide high performance, form factor and cost advantages in a smallest semiconductor package.

The solder bumps used in wafer level packaging  need to demonstrate both high electrical and high mechanical reliability during the lifetime of the product. Alpha Solder spheres, Paste fluxes offer industry leading wafer ball attach solution to meet those requirement. Alpha liquid fluxes provide robust wafer bump reforming processes for wafer bumping applications that utilize electroplated solder bumping processes.

 

Paste Flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
NCX PRL-505 Epoxy o o o   Lo Hi Hi BGA/FCCSP/Wafer
WS600 Water  Soluble o o o o Hi Hi Hi BGA/wafer
WS600-MHV o o o o Hi Hi Hi BGA/wafer
WS9180-MHV o o o o Hi Hi Hi BGA/wafer
WS9190 o o o o Hi Hi Hi BGA/wafer
WSX-HF-HAHV o o o o Hi Hi Hi BGA/wafer
WS9160-M7 o o o o Hi Med Hi BGA/wafer
WS9180-M7 o o o o Hi Med Hi BGA/FCCSP


Sphere

Type Alloy Alloy Tin(Sn) Lead
(Pb)
Silver (Ag) Bismuth (Bi) Copper (Cu) Melting Point (oC) Attributes
Eutectic Solidus Liquidus
Lead Free Standard Sn96.5/Ag3.5 96.5 -- 3.5 -- -- 221 -- -- Eutectic Tin-Silver
SAC405 95.5 -- 4.0 -- 0.5 -- 217 225 Industry Standard Lead-Free
SAC305 96.5 -- 3.0 -- 0.5 -- 217 221 Industry Standard Lead-Free
SAC125 98.3 -- 1.2 -- 0.5 -- 217 228 Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) 
SAC105 98.5 -- 1.0 -- 0.5 -- 217 228
High Reliability SACX Plus®
Modified SAC0307 Alloy -- 217 228
SnCX Plus TM Modified SnCu (Zero Silver) Alloy -- 227 229 Low cost zero Silver alloy
Maxrel TM Modified SAC -- 212 220 High thermal cycle resistance and better than standard drop shock performance
Maxrel Plus TM Modified (Sb Free) -- 211 216
SBX02 TM Modified SnBi Alloy 138 -- -- Low temperature high reliability lead free alloy
Standard Sn42/Bi57.6/Ag0.4  42 --
 0.4  57.6 --
138 -- -- Lead free low melting point
Tin Lead Sn10/Pb90 10 90 -- -- -- -- 275 302 High-Lead for high stand off
Sn62/Pb36/Ag2 62 36 2.0 -- -- 179 -- -- Eutectic Tin-Lead-Silver
Sn63/Pb37 63 37 -- -- -- 183 -- -- Eutectic Tin-Lead
  
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