Aerospace

These technologies will help improve operational accuracy and assemblies reliability, reducing your costs and increasing efficiency.

 

For mission critical operations, Alpha Advanced Materials has developed robust packaging and assembly materials that exhibit high reliability and performance.  Common problems, such as stray particles and moisture are minimized and /or eliminated with our advanced products.  These patented technologies allow for improved operational accuracy with increased durability.  Alpha’s innovations for military applications include: moisture, particle and CO2 getters, solder pastes, fluxes, re-workable thermal plastic adhesives and films.

Getter

Product Name Format Deposition Method Activation Require Getter Type Application
Pick & Place Dispense Print Hydrogen Moisture Particle
STAYDRY® H2- 3000 Film o     o o o   Hi Rel Hermetic Packages: Deefense, Military, Aerospace, Telecom
STAYDRY® GA2000-2 Paste   o o o   o o Hi Rel Hermetic Packages: Military, Defense, Aerospace and Telecom


Non Conductive Polymer

Product Name Format Deposition Method Reworkable  Application
Water Lamination Pick & Place Dispense Spin Coat Dippable Print
STAYCHIP® HEL-27 Paste     o     o   Encasulation, Dam and fill
STAYCHIP® HEL-22 Paste     o     o   Encasulation, Dam and Fill
STAYSTIK®882 Film o o         o Module attach, Thermal Management


Conductive Polymer

Product Name Format Deposition Method Property Application
Water Lamination Pick & Place Dispense Print Reworkable  Thermal  (W/m-k) Tg 
STAYSTIK® 571 Film o o     o Low Low Substrate, backplane attatch
STAYSTIK® 581 Film o o     o Low Mid Substrate, back plane attach

Solder paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Activity Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
NCP1213 No Clean o     o Hi Hi     o       Leadframe
NCP-390 No Clean   o   o Hi Hi o o   o o o SiP/BGA
WS693CPS     o   o Hi Hi o o   o o o SiP/BGA


Paste flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
NCX-390 No Clean o   o o Hi Med Hi BGA/FCCSP
WS9190 Water  Soluble o o o o Hi Hi Hi BGA/wafer
WSX-1405A o o o o Hi Med Hi BGA/FCCSP


Sphere

Type Alloy Alloy Tin(Sn) Lead
(Pb)		 Silver (Ag) Bismuth (Bi) Copper (Cu) Melting Point (oC) Attributes
Eutectic Solidus Liquidus
Lead Free Standard Sn96.5/Ag3.5 96.5 -- 3.5 -- -- 221 -- -- Eutectic Tin-Silver
SAC405 95.5 -- 4.0 -- 0.5 -- 217 225 Industry Standard Lead-Free
SAC305 96.5 -- 3.0 -- 0.5 -- 217 221 Industry Standard Lead-Free
SAC125 98.3 -- 1.2 -- 0.5 -- 217 228 Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) 
SAC105 98.5 -- 1.0 -- 0.5 -- 217 228
High Reliability SACX Plus®
 		Modified SAC0307 Alloy -- 217 228
Maxrel TM Modified SAC -- 212 220 High thermal cycle resistance and better than standard drop shock performance
Maxrel Plus TM Modified (Sb Free) -- 211 216
Standard Sn42/Bi57.6/Ag0.4  42 --
 0.4  57.6 --
138 -- -- Lead free low melting point
Tin Lead
Sn62/Pb36/Ag2 62 36 2.0 -- -- 179 -- -- Eutectic Tin-Lead-Silver
Sn63/Pb37 63 37 -- -- -- 183 -- -- Eutectic Tin-Lead
  
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