Aerospace

These technologies will help improve operational accuracy and assemblies reliability, reducing your costs and increasing efficiency.

 

For mission critical operations, Alpha Advanced Materials has developed robust packaging and assembly materials that exhibit high reliability and performance.  Common problems, such as stray particles and moisture are minimized and /or eliminated with our advanced products.  These patented technologies allow for improved operational accuracy with increased durability.  Alpha’s innovations for military applications include: moisture, particle and CO2 getters, solder pastes, fluxes, re-workable thermal plastic adhesives and films.

Getter

Product Name Format Deposition Method Activation Require Getter Type Application
Pick & Place Dispense Print Hydrogen Moisture Particle
STAYDRY® H2- 3000 Film o     o o o   Hi Rel Hermetic Packages: Deefense, Military, Aerospace, Telecom
STAYDRY® GA2000-2 Paste   o o o   o o Hi Rel Hermetic Packages: Military, Defense, Aerospace and Telecom
STAYDRY®Z20 PSA Film o   
o   o
Hi Rel Hermetic Packages: Military, Defense, Aerospace and Telecom


Non Conductive Polymer

Product Name Format Deposition Method Reworkable  Application
Water Lamination Pick & Place Dispense Spin Coat Dippable Print
STAYCHIP® HEL-27 Paste     o     o   Encasulation, Dam and fill
STAYCHIP® HEL-22 Paste     o     o   Encasulation, Dam and Fill
STAYSTIK®882 Film o o         o Module attach, Thermal Management


Conductive Polymer

Product Name Format Deposition Method Property Application
Water Lamination Pick & Place Dispense Print Reworkable  Thermal  (W/m-k) Tg 
STAYSTIK® 571 Film o o     o Low Low Substrate, backplane attatch
STAYSTIK® 581 Film o o     o Low Mid Substrate, back plane attach

Solder paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Activity Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
NCP1213 No Clean o     o Hi Hi     o       Leadframe
NCP-390 No Clean   o   o Hi Hi o o   o o o SiP/BGA
WS693CPS     o   o Hi Hi o o   o o o SiP/BGA


Paste flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
NCX-390 No Clean o   o o Hi Med Hi BGA/FCCSP
NCX-402-M3     o o Hi Med Hi BGA/FCCSP


Sphere

 

 

Alloy

Elemental Composition

Melting Point (C)

 

Atttribute

Tin (Sn)

Lead (Pb)

Silver (Ag)

Copper (Cu)

Nickel (Ni)

Bismuth (Bi)

 

Eutectic

 

Solidus

 

Liquidus

 

Tin- Lead

Sn63/Pb37

63

37

-

-

-

-

183

-

-

Eutectuc Tin-lead

Sn62/Pb36/Ag2

62

36

2

-

-

-

179

-

-

Eutectuc Tin-lead Silver

 

 

 

 

 

Lead Free

SAC105

98.5

-

1

0.5

-

-

 

217

228

 

Industry standard low silver alloy

SAC125 w/Ni

98.3

-

1.2

0.5

250-500
ppm

-

 

217

228

SAC305

96.5

-

3

0.5

-

-

 

217

221

Industry stardard lead free

SAC405

95.5

-

4

0.5

-

-

 

217

225

Industry stardard lead free

Sn96.5/Ag3.5

96.5

-

3.5

-

-

-

221

-

-

Industry stardard lead free

Sn42/Bi57.6/Ag0.4

42

-

0.4

-

-

57.6

 

 

138

Lead free low melting point

SACX0307

98.9

-

0.3

0.7

-

0.1

 

217

228

Best in class drop shock reliability

SACX0307 Plus

98.9

-

0.3

0.7

 

0.1

 

217

228

MaxRel

 

Proprietary

 212 220

Best in class thermal cycle reliability and drop shock
performance

MaxRel Plus

 209 220

 

HRL1

 138 151

Best in class thermal cycle reliability and drop shock
low temperature alloy
  
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