Memory

Helping the drive to thinner portable designs, increasing reliability and reducing package costs.


Providing net generation materials to build thin, lightweight, portable designs which are enabled by smaller packages sizes in a variety of densities.  Customers can rely on Alpha Advanced Materials' long-term support as well an excellent product platform foundation for high-performance, high-quality, and leading-edge materials.  Take advantage of Alpha Advanced Materials' proven, mature fluxes and spheres and get the best package cost / performance tradeoffs.  Leverage our proven, stable technology currently running in production centers globally enabling our customers to create market leading package and assembly designs.

Getter

Product Name Format Deposition Method Activation Require Getter Type Application
Pick & Place Dispense Print Hydrogen Moisture Particle
HiCap™
2000
Paste   o o     o   Hi Rel Hermetic Packages: Military, Defense, Telecom and Medical


Conductive Polymer

Product Name Format Deposition Method Property Application
Water Lamination Pick & Place Dispense Print Reworkable  Thermal  (W/m-k) Tg 
STAYSTIK® 571 Film o o     o Low Low Substrate, backplane attatch
STAYSTIK® 581 Film o o     o Low Mid Substrate, back plane attach


Solder paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Activity Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
NCP1213 No Clean o     o Hi Hi     o       Leadframe
NCP-390 No Clean   o   o Hi Hi o o   o o o SiP/BGA
WS693CPS Water Soluble   o   o Hi Hi o o   o o o SiP/BGA


Paste flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Vicosity Tackiness
NCX-390 No Clean o   o o Hi Med Hi BGA/FCCSP
WS9190 Water  Soluble o o o o Hi Hi Hi BGA/wafer
WSX-1405A Water  Soluble o o o o Hi Med Hi BGA/FCCSP


Non Conductive Polymer

Product Name Format Deposition Method Reworkable  Application
Water Lamination Pick & Place Dispense Spin Coat Dippable Print
STAYSTIK®882 Film o o         o Module attach, Thermal Management


Sphere

Type Alloy Alloy Tin(Sn) Lead
(Pb)
Silver (Ag) Bismuth (Bi) Copper (Cu) Melting Point (oC) Attributes
Eutectic Solidus Liquidus
Lead Free Standard Sn96.5/Ag3.5 96.5 -- 3.5 -- -- 221 -- -- Eutectic Tin-Silver
SAC405 95.5 -- 4.0 -- 0.5 -- 217 225 Industry Standard Lead-Free
SAC305 96.5 -- 3.0 -- 0.5 -- 217 221 Industry Standard Lead-Free
SAC125 98.3 -- 1.2 -- 0.5 -- 217 228 Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) 
SAC105 98.5 -- 1.0 -- 0.5 -- 217 228
High Reliability SACX Plus®
Modified SAC0307 Alloy -- 217 228
SnCX Plus TM Modified SnCu (Zero Silver) Alloy -- 227 229 Low cost zero Silver alloy
Maxrel TM Modified SAC -- 212 220 High thermal cycle resistance and better than standard drop shock performance
Maxrel Plus TM Modified (Sb Free) -- 211 216
SBX02 TM Modified SnBi Alloy 138 -- -- Low temperature high reliability lead free alloy
Standard Sn42/Bi57.6/Ag0.4  42 --
 0.4  57.6 --
138 -- -- Lead free low melting point
Tin Lead Sn10/Pb90 10 90 -- -- -- -- 275 302 High-Lead for high stand off
Sn62/Pb36/Ag2 62 36 2.0 -- -- 179 -- -- Eutectic Tin-Lead-Silver
Sn63/Pb37 63 37 -- -- -- 183 -- -- Eutectic Tin-Lead
  
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