RF Packages

The latest technologies to drive thermally efficient and RF consistent packaging reliability provide overall package size and cost reductions to meet your needs.

 

Alpha Advanced Materials provides materials for RF communication and industrial applications serving low power, wireless infrastructure, broadcast, commercial aerospace, mobile radio communication, industrial, scientific and medical (ISM), consumer and commercial cooking and defense markets.  With materials exceeding thermal conductivities of previous industry standards for LDMOS, SIGe, GaAs and GaN technologies.  Alpha material solutions are available today meet tomorrows RF application challenges, including reduction in overall system cost, form factor size reduction and simplified system design. Alpha provides the materials and support required to enable our customers to create market leading package designs.

Conductive Die Attach

Product Name Format Deposition Method Thermal (W/m-k) Key Features Component Type
Water Lamination Dispense Print Bare Silicon Compatibility Modulus
ATROX®
800HT2
Paste   o   High   High SO, TO, QFN, TSSO 
ATROX®
800HT2V
Paste   o o Extreme   Mid QFN, SO, TO, TSSO, Cu Clip
ATROX®
800HT5
Paste   o   High o Low QFN, SO, TO, TSSO, LGA, QFP


Getter

Product Name Format Deposition Method Activation Require Getter Type Application
Pick & Place Dispense Print Hydrogen Moisture Particle
STAYDRY® H2- 3000 Film o     o o o   Hi Rel Hermetic Packages: Deefense, Military, Aerospace, Telecom
HiCap™
2000
Paste   o o     o   Hi Rel Hermetic Packages: Military, Defense, Telecom and Medical
STAYDRY® GA2000-2 Paste   o o o   o o Hi Rel Hermetic Packages: Military, Defense, Aerospace and Telecom


Conductive Polymer

Product Name Format Deposition Method Property Application
Water Lamination Pick & Place Dispense Print Reworkable  Thermal  (W/m-k) Tg 
STAYSTIK® 181AK Paste     o o o Low Mid Lid seal,  substrate attach
STAYSTIK® 8000 Film o o       Low High Low Temp lamination, substrate, backplane attach


Paste flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Actiivty Vicosity Tackiness
NCX-390 No Clean o   o o Hi Med Hi BGA/FCCSP
WS5018-HA Water  Soluble o   o   Hi Med Hi FCCSP


Solder paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Activity Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
NCP1213 No Clean o     o Hi Hi     o       Leadframe
NCP-390     o   o Hi Hi o o   o o o SiP/BGA
WS693CPS Water Soluble   o   o Hi Hi o o   o o o SiP/BGA


Sphere

Type Alloy Alloy Tin(Sn) Lead
(Pb)
Silver (Ag) Bismuth (Bi) Copper (Cu) Melting Point (oC) Attributes
Eutectic Solidus Liquidus
Lead Free Standard Sn96.5/Ag3.5 96.5 -- 3.5 -- -- 221 -- -- Eutectic Tin-Silver
SAC405 95.5 -- 4.0 -- 0.5 -- 217 225 Industry Standard Lead-Free
SAC305 96.5 -- 3.0 -- 0.5 -- 217 221 Industry Standard Lead-Free
SAC125 98.3 -- 1.2 -- 0.5 -- 217 228 Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) 
SAC105 98.5 -- 1.0 -- 0.5 -- 217 228
High Reliability SACX Plus®
Modified SAC0307 Alloy -- 217 228
Maxrel TM Modified SAC -- 212 220 High thermal cycle resistance and better than standard drop shock performance
Maxrel Plus TM Modified (Sb Free) -- 211 216
Standard Sn42/Bi57.6/Ag0.4  42 --
 0.4  57.6 --
138 -- -- Lead free low melting point
Tin Lead
Sn62/Pb36/Ag2 62 36 2.0 -- -- 179 -- -- Eutectic Tin-Lead-Silver
Sn63/Pb37 63 37 -- -- -- 183 -- -- Eutectic Tin-Lead
  
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