Liquid Flux


Alpha Advanced Materials liquid flux are formulated to provide unrival soldering performance for flip chip and wafer level processing.  AAM fluxes are developed using the latest Alpha flux technology. Our latest line of liquid flux offer application for  convention flip chip reflow to ultra low residue thermo-compression bonding process and  also  provides highest level of performance for electroplated  wafer bump reform process.  AAM offer  both No-clean and water soluble liquid flux  solutions to meet every customer application needs.


Product Name Material Type Deposition Method Properties Component Type
Dispense Spray Halide Free Activity Tackiness Low Residue
NR310B No Clean o o   Lo Lo   Wafer 
WS3018-FS Water Soluble o o   Hi Lo  o FCCSP
OA5304HF o o o Hi Hi  o Wafer
OA1303 o o o Hi Hi  o Wafer
  
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