Paste Flux


Alpha Paste flux offers industry leading  soldering performance  for semiconductor packaging applications. The latest range of AAM paste flux are formulated with latest Alpha  halogen free flux technology to deliver high activity,  long  stencil and shelif life. 

AAM No-clean and Water soluble paste flux  delivers robust and  high yield for solder ball attach, flip chip and other soldering applications. AAM water soluble paste flux  is the leading choice of solder flux for wafer level CSP and BGA/ CSP ball attach applications.


Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Viscosity Tackiness
NCX340

 

 

No Clean

o o o   Hi Med Hi BGA/FCCSP
NCX-390 o   o o Hi Med Hi BGA/FCCSP
NCX402 o   o o Lo Med Hi BGA/FCCSP
POP707     o o Hi Lo Hi BGA/FCCSP/POP
NCX PRL-507 Epoxy
o   Lo Hi Hi Wafer
WS3018-HA

Water  Soluble

o o o   Lo Med Hi FCCSP
WS3018-LV   o o   Lo Lo Lo FCCSP
WS608 o o
o o Hi Hi Hi BGA/FCCSP
WS600 o o o o Hi Hi Hi BGA/wafer
WS600-MHV o o o o Hi Hi Hi BGA/wafer
WS9180-MHV o o o o Hi Hi Hi BGA/wafer
WS9190 o o o o Hi Hi Hi BGA/wafer
WSX-HF-HAHV o o o o Hi Hi Hi BGA/wafer
WS9160-M7 o o o o Hi Med Hi BGA/wafer
WS9180-M7 o o o o Hi Med Hi BGA/FCCSP
WSX-HAHF o o o o Hi Med Hi BGA/FCCSP
WSX-9200 o o o o Hi Hi Hi BGA/FCCSP
WSX-1207 o o o o Hi Med Hi BGA/FCCSP
WSX-1405HV o o o o Hi Med Hi BGA/FCCSP
WSX9284 o o o o Hi Hi Hi BGA/FCCSP
  
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