Power Cycling

Power cycling involves temperature fluctuations that may result in thermal fatigue and bond failure.  Temperature increases can accelerate bond degradation and reduce the overall reliability of your package. Not only can Argomax® help you avoid these problems, it can help you achieve new levels of efficiency. Also, Argomax is ideal for SiC and GaN devices because high reliability can be achieved even at operating temperatures ≥200°C.

The way our customers are pushing the reliability envelope, demonstrates they understand what Argomax can bring to them: Argomax passes 1000 hours at temperatures above 300°C or 1000 thermal shocks cycles at a ΔT greater than 270°C. This is a clear example of Argomax capabilities.

Argomax® Products

Application Paste Film Attachment to Ag, Au Attachment to Cu Argomax Product
Printing Dispensing
Power Modules X     X   20102020
X       X 5020
    X X   8020
    X   X 8050
Power Discretes   X   X   2040
  X     X 5040
    X X   8020
    X   X 8050
Bipolar Devices     X     8010
Cavity Packages   X   X   2040
  X     X 5040
    X X   8020
    X   X 8050
Wafer Level Processing     X X   8030
    X   X 8035

Fortibond™ - Alpha Fortibond Products to enable high reliability with power cycling.

  
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