Alpha Advanced Materials' product line offerings include low-Ag alloys, halogen-free fluxing technologies, higher thermal cycling and drop resistance alloys combine to deliver higher activity and better reliability for your high volume manufacturing needs.
Alpha Advanced Materials fluxes are formulated using the latest flux technology to provide universal soldering performance for flip chip and wafer level processing. Our newest line of fluxes offer ultra low no-clean residue for Copper Pillar thermo-compression bonding (TCB) applications for convention flip chip reflow to 3D stacking processes.
Alpha Advanced Materials next generation high reliability alloys employ advanced metallurgy technologies for all of your solder hierarchy needs; providing high-reliability spheres in the standard SAC, low and mid-range alloy temperature segments. The latest range of Alpha® spheres and alloys such as Maxrel PlusTM or SBX02TM for solder paste help assure alloy-to-alloy compatibility providing stronger more reliable solder joints. All of Alpha Advanced Materials solder pastes and spheres conform to our customers’ unique processes, as well as the challenging environmental regulations they are required to follow.
Liquid Flux
| Product Name |
Material Type |
Deposition Method |
Properties |
Component Type |
| Pin Transfer |
Dispense |
Print |
Dip |
Spray |
Halide Free |
Activity |
Tackiness |
Low Residue |
| NCX-009 |
No Clean |
|
|
|
|
|
o |
Lo |
Lo |
o |
Wafer/FCCSP |
| WS3018-FS |
Water Soluble |
|
o |
|
|
o |
|
Hi |
Lo |
|
FCCSP |
Paste flux
| Product Name |
Material Type |
Deposition Method |
Properties |
Component Type |
| Pin Transfer |
Print |
Dip |
Halide Free |
Activity |
Vicosity |
Tackiness |
| NCX-390 |
No Clean |
o |
|
o |
o |
Hi |
Med |
Hi |
BGA/FCCSP |
| OL107 |
No Clean |
o |
|
o |
|
Hi |
Med |
Hi |
BGA/POP |
| NCX PRL-505 |
Epoxy |
o |
o |
o |
|
Lo |
Hi |
Hi |
BGA/FCCSP/Wafer |
| WS3018-HA |
Water Soluble |
o |
o |
o |
|
Lo |
Med |
Hi |
FCCSP |
| WS3018-LV |
|
o |
o |
|
Lo |
Lo |
Lo |
FCCSP |
| WS5018-HA |
o |
|
o |
|
Hi |
Med |
Hi |
FCCSP |
Solder paste
| Product Name |
Material Type |
Deposition Method |
Properties |
Powder Size |
Component Type |
| Dispense |
Print |
Dip |
Halide Free |
Activity |
Tackiness |
Fine Pitch Capable |
Lead Free |
Type 3 |
Type 4 |
Type 5 |
Type 6 |
| OM-340 |
No Clean |
|
o |
|
o |
Hi |
Hi |
o |
o |
|
o |
|
|
SiP/BGA |
| WS609 |
Water Soluble |
|
o |
|
o |
Hi |
Hi |
|
o |
o |
o |
|
|
SiP/BGA |
| WS693CPS |
|
o |
|
o |
Hi |
Hi |
o |
o |
|
o |
o |
o |
SiP/BGA |
Sphere
| Type |
Alloy |
Alloy |
Tin(Sn) |
Lead
(Pb) |
Silver (Ag) |
Bismuth (Bi) |
Copper (Cu) |
Melting Point (oC) |
Attributes |
| Eutectic |
Solidus |
Liquidus |
| Lead Free |
Standard |
Sn96.5/Ag3.5 |
96.5 |
-- |
3.5 |
-- |
-- |
221 |
-- |
-- |
Eutectic Tin-Silver |
| SAC405 |
95.5 |
-- |
4.0 |
-- |
0.5 |
-- |
217 |
225 |
Industry Standard Lead-Free |
| SAC305 |
96.5 |
-- |
3.0 |
-- |
0.5 |
-- |
217 |
221 |
Industry Standard Lead-Free |
| SAC125 |
98.3 |
-- |
1.2 |
-- |
0.5 |
-- |
217 |
228 |
Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) |
| SAC105 |
98.5 |
-- |
1.0 |
-- |
0.5 |
-- |
217 |
228 |
| High Reliability |
SACX Plus®
|
Modified SAC0307 Alloy |
-- |
217 |
228 |
| Maxrel TM |
Modified SAC |
-- |
212 |
220 |
High thermal cycle resistance and better than standard drop shock performance |
| Maxrel Plus TM |
Modified (Sb Free) |
-- |
211 |
216 |
| Standard |
Sn42/Bi57.6/Ag0.4 |
42 |
--
|
0.4 |
57.6 |
--
|
138 |
-- |
-- |
Lead free low melting point
|
| Tin Lead |
| Sn62/Pb36/Ag2 |
62 |
36 |
2.0 |
-- |
-- |
179 |
-- |
-- |
Eutectic Tin-Lead-Silver |
| Sn63/Pb37 |
63 |
37 |
-- |
-- |
-- |
183 |
-- |
-- |
Eutectic Tin-Lead |