The most popular ball attach technology in the industry is the use of pin transfer using paste flux and solder sphere . Alpha provides industry leading fluxing technolgoy for 100% first pass yield for sphere attach process on ENIG, ENEPIG and CuOSP pad finishes. Alpha sphere attach solutions demonstrate superior solder ball coplanarity, solder ball height, solder ball diameter and high solder ball shear for robust process yields even on poor surface conditions
Paste Flux
| Product Name |
Material Type |
Deposition Method |
Properties |
Component Type |
| Pin Transfer |
Print |
Dip |
Halide Free |
Activity |
Vicosity |
Tackiness |
| POP707 |
No Clean |
|
|
o |
o |
Hi |
Lo |
Hi |
BGA/FCCSP/POP |
| NCX PRL-505 |
Epoxy |
o |
o |
o |
|
Lo |
Hi |
Hi |
BGA/FCCSP/Wafer |
| WS600 |
Water Soluble |
o |
o |
o |
o |
Hi |
Hi |
Hi |
BGA/wafer |
| WS600-MHV |
o |
o |
o |
o |
Hi |
Hi |
Hi |
BGA/wafer |
| WS9180-MHV |
o |
o |
o |
o |
Hi |
Hi |
Hi |
BGA/wafer |
| WS9190 |
o |
o |
o |
o |
Hi |
Hi |
Hi |
BGA/wafer |
| WSX-HF-HAHV |
o |
o |
o |
o |
Hi |
Hi |
Hi |
BGA/wafer |
| WS9180-M7 |
o |
o |
o |
o |
Hi |
Med |
Hi |
BGA/FCCSP |
| WSX-HAHF |
o |
o |
o |
o |
Hi |
Med |
Hi |
BGA/FCCSP |
| WSX-9200 |
o |
o |
o |
o |
Hi |
Hi |
Hi |
BGA/FCCSP |
| WSX-1207 |
o |
o |
o |
o |
Hi |
Med |
Hi |
BGA/FCCSP |
| WSX-1405A |
o |
o |
o |
o |
Hi |
Med |
Hi |
BGA/FCCSP |
Sphere
| Type |
Alloy |
Alloy |
Tin(Sn) |
Lead
(Pb) |
Silver (Ag) |
Bismuth (Bi) |
Copper (Cu) |
Melting Point (oC) |
Attributes |
| Eutectic |
Solidus |
Liquidus |
| Lead Free |
Standard |
Sn96.5/Ag3.5 |
96.5 |
-- |
3.5 |
-- |
-- |
221 |
-- |
-- |
Eutectic Tin-Silver |
| SAC405 |
95.5 |
-- |
4.0 |
-- |
0.5 |
-- |
217 |
225 |
Industry Standard Lead-Free |
| SAC305 |
96.5 |
-- |
3.0 |
-- |
0.5 |
-- |
217 |
221 |
Industry Standard Lead-Free |
| SAC125 |
98.3 |
-- |
1.2 |
-- |
0.5 |
-- |
217 |
228 |
Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) |
| SAC105 |
98.5 |
-- |
1.0 |
-- |
0.5 |
-- |
217 |
228 |
| High Reliability |
SACX Plus®
|
Modified SAC0307 Alloy |
-- |
217 |
228 |
| SnCX Plus TM |
Modified SnCu (Zero Silver) Alloy |
-- |
227 |
229 |
Low cost zero Silver alloy |
| Maxrel TM |
Modified SAC |
-- |
212 |
220 |
High thermal cycle resistance and better than standard drop shock performance |
| Maxrel Plus TM |
Modified (Sb Free) |
-- |
211 |
216 |
| SBX02 TM |
Modified SnBi Alloy |
138 |
-- |
-- |
Low temperature high reliability lead free alloy |
| Standard |
Sn42/Bi57.6/Ag0.4 |
42 |
--
|
0.4 |
57.6 |
--
|
138 |
-- |
-- |
Lead free low melting point
|
| Tin Lead |
Sn10/Pb90 |
10 |
90 |
-- |
-- |
-- |
-- |
275 |
302 |
High-Lead for high stand off |
| Sn62/Pb36/Ag2 |
62 |
36 |
2.0 |
-- |
-- |
179 |
-- |
-- |
Eutectic Tin-Lead-Silver |
| Sn63/Pb37 |
63 |
37 |
-- |
-- |
-- |
183 |
-- |
-- |
Eutectic Tin-Lead |