Selective Soldering

There has been a rapid increase in the use of selective soldering equipment for PCB assembly. This is primarily due to the decrease in the number of through hole devices designed into boards along with the reduced equipment investment required. Because the selective soldering process is so much different than wave soldering, Alpha has developed and qualified a variety of high performing, cost effective soldering materials for use in selective soldering processes.

Selective solder guide image

Alpha Selective Soldering Guide

Alpha Products for Selective Soldering

Alpha Liquid Solder Fluxes

Product Lead-Free SnPb High Reliability Low Ag Water Soluble
EF-5601 X X   X  
EF-6000 X X   X  
EF-6100 X X X X  
EF-6103 X X X X  
EF-6850HF X   X X  
EF-8000 X X X X  
EF-8800HF X   X X  
EF-9301 X X X X  


Read the Article - Comparing The Performance of Engineered Tin/Copper Alloys in Selective Soldering


Alpha Solder Alloys

Use the chart below to determine which Alpha alloy is right for you. Simply align the type of assembly being made with the appropriate alloy.

 Assembly Type
Simple, single sided, FR2 / CEM-1 laminates
Dual sided FR-4 w/ PTH's, 1.6mm thick, up to 4 inner copper layers, metallized pad finishes
Complex, up to 12 inner copper layers, OSP pad finishes, all processing in air
>2.4mm thick, >12 inner copper layers, large high heat capacity components
 SACX Plus 0807

 SAC alloys label for table
  1%+ flux solids, L0, pin testable
Flux Type
  SACX Plus 0307
    4%+ flux solids, L or M0, pin testable
SnCX Plus® 07
          4%+ flux solids, L or M0, moderately pin testable
            7%+ flux solids, L,M or H1, not pin testable
0ºC to 100ºC - standard profile cycles
0ºC to 100ºC - standard and shock profile cycles
- 25ºC to 125ºC - standard and shock profile cycles
- 45ºC to 125ºC - standard and shock profile cycles
Thermal Fatigue Resistance



Comparing the Performance of Engineered Tin_Copper Alloys in Selective Soldering - Download Whitepaper

(Press ctrl to select multiple)