Automotive

Our goal is to help you improve automotive electronics reliability reduce your warranty costs.

 

The automotive industry is rapidly increasing its use of electronics to enhance the safety, comfort, performance and overall enjoyment of the driving experience. As a result of longer vehicle warranty periods, automobile manufacturers are demanding higher reliability, improved manufacturing efficiency and vastly reduced warranty failures, from all of their Tier 1 suppliers. Alpha is committed to meeting this challenge with groundbreaking electronic packaging and assembly materials, cutting edge research and development and our dedicated global application and technical engineering experts and strategically located labs.

Conductive Polymer

Product Name Format Deposition Method Property Application
Water Lamination Pick & Place Dispense Print Reworkable  Thermal  (W/m-k) Tg 
POLYSOLDER SE3001 Paste     o o   Medium Mid Substrate attach, DCA. COB attach, Lid seal


Non Conductive Polymer

Product Name Format Deposition Method Reworkable  Application
Water Lamination Pick & Place Dispense Spin Coat Dippable Print
STAYCHIP® F6142 Paste     o     o   Lid attach, 


Conductive Die Attach

Product Name Format Deposition Method Thermal (W/m-k) Key Features Component Type
Water Lamination Dispense Print Bare Silicon Compatibility Modulus
ATROX®
800HT2V		 Paste   o o Extreme   Mid QFN, SO, TO, TSSO, Cu Clip
ATROX®
800HT7		 Paste   o o High o Low QFP, QFN, LGA, SO, BGA 
ATROX®
800HT5		 Paste   o   High o Low QFN, SO, TO, TSSO, LGA, QFP


Paste flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Actiivty Vicosity Tackiness
WS5018-HA Water  Soluble o   o   Hi Med Hi FCCSP
WSX-1207 o o o o Hi Med Hi BGA/FCCSP
WSX-1405A o o o o Hi Med Hi BGA/FCCSP
WS9190 o o o o Hi Hi Hi BGA/wafer


Solder paste

Product Name Material Type Deposition Method Properties Powder Size Component Type
Dispense Print Dip Halide Free Actiivty Tackiness Fine Pitch Capable Lead Free Type 3 Type 4 Type 5 Type 6
NCP-390 No Clean   o   o Hi Hi o o   o o o SiP/BGA
WS693CPS Water Soluble   o   o Hi Hi o o   o o o SiP/BGA


Sphere

Type Alloy Alloy Tin(Sn) Lead
(Pb)		 Silver (Ag) Bismuth (Bi) Copper (Cu) Melting Point (oC) Attributes
Eutectic Solidus Liquidus
Lead Free Standard Sn96.5/Ag3.5 96.5 -- 3.5 -- -- 221 -- -- Eutectic Tin-Silver
SAC405 95.5 -- 4.0 -- 0.5 -- 217 225 Industry Standard Lead-Free
SAC305 96.5 -- 3.0 -- 0.5 -- 217 221 Industry Standard Lead-Free
SAC125 98.3 -- 1.2 -- 0.5 -- 217 228 Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) 
SAC105 98.5 -- 1.0 -- 0.5 -- 217 228
High Reliability SACX Plus®
 		Modified SAC0307 Alloy -- 217 228
Maxrel TM Modified SAC -- 212 220 High thermal cycle resistance and better than standard drop shock performance
Maxrel Plus TM Modified (Sb Free) -- 211 216
Standard Sn42/Bi57.6/Ag0.4  42 --
 0.4  57.6 --
138 -- -- Lead free low melting point
Tin Lead
Sn62/Pb36/Ag2 62 36 2.0 -- -- 179 -- -- Eutectic Tin-Lead-Silver
Sn63/Pb37 63 37 -- -- -- 183 -- -- Eutectic Tin-Lead
  
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