Improving your semiconductor reliability, reducing your costs and increasing your Semiconductor production efficiencies is our goal.

The Semiconductor market is growing dramatically every year globally. Our world is in constant movement and in need for some new technologies that will improve reliability and enhance performances for all the key electronic packaging and assembly applications. 
Alpha Advanced Materials is committed to the development of unique die attach and assembly products that are designed to meet the demanding applications for today and into the future of the semiconductor industry.

Conductive Die Attach

Product Name Format Deposition Method Thermal (W/m-k) Key Features Component Type
Water Lamination Dispense Print Bare Silicon Compatibility Modulus
558- 2C31
Paste   o   Low o Low QFN, SO, BGA, QFP, TSSO, LGA
Paste   o o Medium o Low QFN, SO, TSSO, LGA

Non Conductive Polymer

Product Name Format Deposition Method Reworkable  Application
Water Lamination Pick & Place Dispense Spin Coat Dippable Print
STAYCHIP® 3082 Paste     o     o   Underfilling, 
STAYCHIP® HEL-27 Paste     o     o   Encasulation, Dam and fill
STAYCHIP® HEL-22 Paste     o     o   Encasulation, Dam and Fill

Paste Flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Actiivty Vicosity Tackiness
NCX-390 No Clean o   o o Hi Med Hi BGA/FCCSP
NCX PRL-505 Epoxy o o o   Lo Hi Hi BGA/FCCSP/Wafer
WS5018-HA Water  Soluble o   o   Hi Med Hi FCCSP
WS9180-MHV o o o o Hi Hi Hi BGA/wafer
WS9190 o o o o Hi Hi Hi BGA/wafer
WSX-HF-HAHV o o o o Hi Hi Hi BGA/wafer

Liquid Flux

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Dispense Print Dip Spray Halide Free Actiivty Tackiness Low Residue
NCX-009 No Clean           o Lo Lo o Wafer/FCCSP 
OA5304HF Water Soluble   o     o o Hi Hi   Wafer


Type Alloy Alloy Tin(Sn) Lead
Silver (Ag) Bismuth (Bi) Copper (Cu) Melting Point (oC) Attributes
Eutectic Solidus Liquidus
Lead Free Standard Sn96.5/Ag3.5 96.5 -- 3.5 -- -- 221 -- -- Eutectic Tin-Silver
SAC405 95.5 -- 4.0 -- 0.5 -- 217 225 Industry Standard Lead-Free
SAC305 96.5 -- 3.0 -- 0.5 -- 217 221 Industry Standard Lead-Free
SAC125 98.3 -- 1.2 -- 0.5 -- 217 228 Low-Silver Lead-Free alloys for optimal drop-shock resistance (SACX contain Proprietary materials) 
SAC105 98.5 -- 1.0 -- 0.5 -- 217 228
High Reliability SACX Plus®
Modified SAC0307 Alloy -- 217 228
SnCX Plus TM Modified SnCu (Zero Silver) Alloy -- 227 229 Low cost zero Silver alloy
Maxrel TM Modified SAC -- 212 220 High thermal cycle resistance and better than standard drop shock performance
Maxrel Plus TM Modified (Sb Free) -- 211 216
SBX02 TM Modified SnBi Alloy 138 -- -- Low temperature high reliability lead free alloy
Standard Sn42/Bi57.6/Ag0.4  42 --
 0.4  57.6 --
138 -- -- Lead free low melting point
Tin Lead Sn10/Pb90 10 90 -- -- -- -- 275 302 High-Lead for high stand off
Sn62/Pb36/Ag2 62 36 2.0 -- -- 179 -- -- Eutectic Tin-Lead-Silver
Sn63/Pb37 63 37 -- -- -- 183 -- -- Eutectic Tin-Lead
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