Features & Benefits

  • Good Thermal Conductivity > 20 W/m-K
  • Low stress material for small to medium size die packages (< 25mm2)
  • Low RBO and compatible with multiple lead-frame surfaces: Cu & PPF (NiPdAu)
  • Compatible with Bare Si and metalized die surfaces
  • High through put dot and pattern dispense capable with excellent workability across all leadframe designs
  • Lower temperature cure for exposed pad packages
  • Ultra Low voiding on small to medium size die on various leadframe / component finishes.
  • Excellent reliability properties and able to pass MSL3 conditions
  • Compatible with either nitrogen or air cure conditions

Application Methods

  • Syringe / Shower Head Dispense
  • Screen / Stencil Print
(Press ctrl to select multiple)