POLYSOLDER SE3001

Features & Benefits

  • Good Thermal Conductivity > 5 W/m-K
  • Can be cured by thermal processing in standard IR, full convection, conduction or vapor phase oven equipment
  • Compatible with either nitrogen or air cure conditions
  • Short cure time, low temperature with excellent thermal stability
  • Low RBO and compatible with multiple lead-frame surfaces: Cu & PPF (NiPdAu)
  • Compatible with Bare Si and metalized die surfaces
  • High through put dot and pattern dispense capable with excellent workability across all leadframe designs
  • Lower temperature cure for exposed pad packages
  • Ultra Low voiding on medium to large size die on various leadframe / component finishes.
  • Stable contact resistance during stress testing and device operation

Application Methods

  • Syringe / Shower Head Dispense
  • Screen / Stencil Print
  
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