OA5304HF

FEATURES AND BENEFITS

  • Excellent activity allows for superior wetting, maximizing wetting and yields.
  • Its high temperature stable solvent system prevents flux dry out during reflow.
  • Best adapted to bump forming process of lead-free SAC alloys and even high temperature alloys such as 5Sn95Pb
  • Excellent cleanability; residues are easily cleaned with DI water even after solder reflow process at 320 - 330°C.
  • Suitable for various wafer sizes up to 300mm.
  • Halide and Halogen free formulation
  
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