Features & Benefits

  • High Tg FILL encapsulant for SOIC and direct chip SMT applications
  • Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature)
  • Low ionics, high purity FILL encapsulant material
  • Long pot-life / work life
  • Fast, efficient flow properties
  • Small particle size filler for use on fine pitch array packages
  • Moderate cure times and temperature with excellent thermal operational stability

Application Methods

  • Syringe dot / pattern dispense
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