Paste Flux

Alpha Paste flux offers industry leading  soldering performance  for semiconductor packaging applications. The latest range of AAM paste flux are formulated with latest Alpha  halogen free flux technology to deliver high activity,  long  stencil and shelif life. 

AAM No-clean and Water soluble paste flux  delivers robust and  high yield for solder ball attach, flip chip and other soldering applications. AAM water soluble paste flux  is the leading choice of solder flux for wafer level CSP and BGA/ CSP ball attach applications.

Product Name Material Type Deposition Method Properties Component Type
Pin Transfer Print Dip Halide Free Activity Viscosity Tackiness
NCX340

 

 

No Clean

 o o o   Hi Med Hi BGA/FCCSP
NCX-390 o   o o Hi Med Hi BGA/FCCSP
NCX402-M3
  o o Hi Med Hi BGA/FCCSP
NCX PRL-507 Epoxy
o   Lo Hi Hi Wafer
WS608 Water Soluble
 o o
o o Hi Hi Hi BGA/FCCSP
WS630 o o o o Hi Hi Hi BGA/FCCSP
WS600-MHV o o o o Hi Hi Hi BGA/wafer
WS698 o o o o Hi Hi Hi BGA/FCCSP
WS9180-MHV o o o o Hi Hi Hi BGA/wafer
WSX-9200 o o o o Hi Hi Hi BGA/FCCSP
WSX-HF-HAHV o o o o Hi Hi Hi BGA/wafer
WS9160-M7 o o o o Hi Med Hi BGA/wafer
WSX-9200 o o o o Hi Hi Hi BGA/FCCSP
WSX9284 o o o o Hi Hi Hi BGA/FCCSP
  
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