WS5018-HA

Features & Benefits

  • Very high activity allows for excellent soldering to ENIG and Cu OSP for flip chip process
  • Superior wetting maximizing assembly yields for flip chip
  • Excellent cleanability performance with DI water temperatures from 55 – 60ºC
  • Compatible with WS5018-FS for dip and spray combo proces
  • Halogen free formulation

 

Application Methods

  • Chip / small package dippable

  
*
(Press ctrl to select multiple)
*