Miniaturization

Electronics miniaturization demands high-density solder joints as small as 100 to 106 μm in diameter.  Therefore, the size and geometry of solder joints are paramount issues in the implementation of lead-free solders.  To that end, the Intermetallic Compound (IMC) layer formed by Alpha’s solder materials is of optimal thickness for good wetting and bonding with minimized brittleness that increases mechanical failures.

Alpha products that enables miniaturization:

Solder Paste

Product Lead-Free SnPb Low Temp High Reliability Low Ag Water Soluble
OM-353 X


X  
OM-340 X


X
  
CVP-390 X
     X X
  

 

Solder Preforms

Size Dimensions Volume Pb-Free Sn-Pb SnBiAg
a b c
inch mm mm mm3
0201 0503 0.51 0.25 0.25 0.032   X  
0201S 0403 0.44 0.28 0.28 0.034 X    
0202 0505 0.51 0.51 0.25 0.065 X X  
03015 0838 0.76 0.38 0.25 0.072   X  
03015S 06035 0.60 0.35 0.35 0.074 X    
0402H 1006H 1.00 0.60 0.25 0.150 X X *
0402 1006 1.00 0.50 0.50 0.250 X X X
0402B 10055 1.00 0.55 0.55 0.303 X X *
0603H 1608H 1.60 0.80 0.50 0.640 X X *
0603 1608 1.60 0.80 0.80 1.024 X X X
0805H 2013H 2.01 1.30 0.40 1.045 X X *
0805 2013 2.01 1.30 0.76 1.986 X X X
0805S 2013S 2.01 1.30 1.30 3.397 X X *
1206 3015 3.00 1.47 0.77 3.396 X X *
1406 3515 3.56 1.52 0.77 4.167 X X *

*production will depend on market demand, please check with your local sales representative for availability

  
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