Assembly Type
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I |
II |
III |
IV |
Simple, single sided, FR2 / CEM-1 laminates
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Dual sided FR-4 w/ PTH's, 1.6mm thick, up to 4 inner copper layers, metallized pad finishes
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Complex, up to 12 inner copper layers, OSP pad finishes, all processing in air
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>2.4mm thick, >12 inner copper layers, large high heat capacity components
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SACX Plus 0807
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1%+ flux solids, L0, pin testable
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Flux Type
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SACX Plus 0307
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4%+ flux solids, L or M0, pin testable
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SnCX Plus™ 07
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4%+ flux solids, L or M0, moderately pin testable
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7%+ flux solids, L,M or H1, not pin testable
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0ºC to 100ºC - standard profile cycles
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0ºC to 100ºC - standard and shock profile cycles
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- 25ºC to 125ºC - standard and shock profile cycles
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- 45ºC to 125ºC - standard and shock profile cycles
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Thermal Fatigue Resistance
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